3-Wheel Mechanical Strength Test for ICC

Evaluation of mechanical strength of ICC modules using the three-wheel mechanical stress method specified in ISO/IEC 10373-1.

Abrasion Stress Method

See ISO/IEC 24789-2, 5.11;

See ISO/IEC 10373-7:2019, 9.2;

See ISO/IEC 10373-7:2019, 9.1;

See ISO/IEC 24789-2, 5.5.3;

See ISO/IEC 24789-2, 5.4.3;

See ISO/IEC 24789-2, 5.3.3;

Assessment of card surface adhesion and resistance to blocking after stacked exposure under elevated temperature and controlled humidity according to ISO/IEC 10373-1.

Artificial Daylight Exposure Stress Method

Measurement of card deflection under defined static load to determine bending stiffness and residual deformation in accordance with ISO/IEC 10373-1.

Book Bend Stress Method (Back Pocket)

Book Warpage Evaluation Method

Measurement of card thickness and width under controlled load and environmental conditions according to ISO/IEC 10373-1 to verify compliance with ISO/IEC 7810 physical characteristics.

Verification of card dimensional stability and flatness after environmental exposure cycles at specified temperature and humidity conditions as defined in ISO/IEC 10373-1.

Measurement of card flatness deviation (warpage) using a rigid reference plate and gauge in accordance with ISO/IEC 10373-1 to verify compliance with base standard dimensional requirements.

Colour Fastness Evaluation Method

Conditioning Stress Method

See ISO/IEC 24789-2, 5.10.3;

Datapage and Cover Warpage Evaluation Method

Dynamic Bend Stress Method

Evaluation of mechanical and functional durability of cards under cyclic bending around defined axes using calibrated jaw geometry as specified in ISO/IEC 10373-1.

Assessment of card mechanical and electrical robustness under cyclic torsional stress at defined rotation angles and frequency according to ISO/IEC 10373-1.

Verification of ICC resistance to electrostatic discharge events in accordance with ISO/IEC 10373-1 and referenced IEC ESD standards.

Assessment of proximity and vicinity integrated circuit cards under electrostatic field stress conditions as defined in ISO/IEC 10373-1.

Measurement of embossed character overall height and relief height using precision micrometer methods defined in ISO/IEC 10373-1.

Functional PIC Evaluation Method

See ISO/IEC 10373-7:2019, 8;

See ISO/IEC 10373-7:2019, 7.2;

Verification of dimensions and positional accuracy of ICC contacts using default ICC holder and reference axes in accordance with ISO/IEC 10373-1 and ISO/IEC 7816-2.

Assessment of mechanical robustness of ICC contact pads under defined mechanical loading conditions according to ISO/IEC 10373-1.

Measurement of electrical resistance of ICC contact pads using defined electrical conventions and apparatus in accordance with ISO/IEC 10373-1.

See ISO/IEC 24789-2, 5.9;

Impact Stress Method

See ISO/IEC 10373-7:2019, 8.3;

See ISO/IEC 24789-2, 5.2.3;

See ISO/IEC 10373-7:2019, 8.2.2;

Measurement of card opacity at near-IR and far-IR wavelengths using calibrated emitter-detector alignment to verify optical transmission limits defined in the base standard.

Operational Climate Stress Method

<p>Verification that the PCD uses an AFI value of '00' in at least one REQB/WUPB polling command as required by ISO/IEC TS 24192-1 for public transport interoperability.</p>

<p>Verification that the PCD correctly detects and resumes communication with a Type A PICC after having received a modulated field prior to ATQA reception in accordance with ISO/IEC TS 24192-2.</p>

<p>Verification that the PCD correctly detects and resumes communication with a Type B PICC after having received a modulated field prior to ATQB reception in accordance with ISO/EC TS 24192-2.</p>

This test verifies that the PCD is immune to ElectroMagnetic Disturbance (EMD) signals generated by the PICC.

This test verifies the ability of the PCD to recover correctly after exposure to ElectroMagnetic Disturbance events.

<p>Verification that the PCD correctly returns to ISO/IEC 14443-4 protocol operation when no suitable non-ISO/IEC 14443-4 application is found as required for PT interoperability.</p>

<p>Verification that the PT reader correctly handles reserved-for-future-use (RFU) bits and parameter values in accordance with ISO/IEC 14443 series requirements under the ISO/IEC TS 24192-2 test plan.</p>

<p>Measurement of the average detection and selection time for a Type A PT object entering the reader field verifying compliance with the tdetect requirement definded in ISO/IEC TS 24192-1.</p>

<p>Measurement of the average detection and selection time for a Type B PT object entering the reader field verifying compliance with the tdetect requirement define in ISO/IEC TS 24192-1.</p>

<p>This test measures the minimum and maximum magnetic field strength produced by a PCD within its operating volume under load conditions.</p>

This test verifies the PCD's ability to correctly receive load modulation signals from a PICC at bit rates from fc/128 to fc/16.

This test verifies the PCD's ability to correctly receive load modulation signals from a PICC at bit rates from fc/8 to fc/2.

This test verifies the modulation index and waveform characteristics of the PCD according to ISO/IEC 14443-2 requirements.

This test measures the phase stability of the PCD RF carrier to ensure compliance with specified limits.

This test determines that the PCD generates a field not higher than the average value specified in ISO/IEC 14443-1 for each PICC class.

<p>Additional PCD tests of ISO/IEC 14443-3 and ISO/IEC 14443-4 parameters shall be as defined in ISO/IEC 10373-6 Annex H</p>

Verification that a Public Transport (PT) object acting as a PICC complies with the ISO/IEC 14443 series under the additional conditions defined in ISO/IEC TS 24192-2.

This test measures the EMD level generated by the PICC and verifies compliance with the allowed limits.

<p>Verification that the PICC remains operational and does not produce incorrect responses during controlled magnetic field ramp-up and ramp-down conditions as required for public transport interoperability.</p>

Verification that the PT object correctly handles unexpected or RFU bits and parameter values in accordance with ISO/IEC 14443 requirements under the ISO/IEC TS 24192-2 test plan.

This test evaluates the maximum loading effect of the PICC on the PCD antenna current.

This test verifies the correct operation of the PICC at minimum and maximum specified field strength levels.

This test verifies that the PICC correctly receives and processes PCD modulation signals under defined field conditions.

This test determines the resonance frequency of the PICC antenna and verifies that it falls within the specified range.

This test verifies the behaviour of the PICC when exposed to alternating magnetic fields at 13.56 MHz under specified conditions.

PICC tests of ISO/IEC 14443-3 and ISO/IEC 14443-4 parameters shall be as defined in ISO/IEC 10373-6 Annex G and Annex L.

<p>This test verifies that the PICC transmission characteristics meet the amplitude phase and timing requirements.</p>

Peel Strength Evaluation Method

Measurement of peel strength at the edge and centre of the card using a stabilised tensile test arrangement to evaluate layer adhesion performance according to ISO/IEC 10373-1.

Determination of interlayer bond strength of card materials using tensile peel testing at defined speed and geometry in accordance with ISO/IEC 10373-1.

Pen Stress Method

Physical Damage Evaluation Method

See ISO/IEC 24789-2, 5.6.3;

Resistance to Chemicals Stress Method

Evaluation of card performance and appearance after exposure to defined short-term and long-term chemical solutions including salt mist and artificial perspiration

Determination of card structural stability and deformation after exposure to elevated temperature conditions as specified in ISO/IEC 10373-1.

Sheet Pull Stress Method

Sheet Turning Stress Method

See ISO/IEC 10373-7:2019, 5;

Storage Temperature Stress Method

See ISO/IEC 24789-2, 5.1.3;

<p>Measurement of surface distortions; raised or depressed areas (excluding embossing) using profile measurement methods referenced by ISO/IEC 10373-1.</p>

See ISO/IEC 24789-2, 5.8.3;

See ISO/IEC 24789-2, 5.7.3;

Thermal Cycling Stress Method

Torsion Stress Method

See ISO/IEC 10373-7:2019, 8.1.2;

Verification that the card remains testably functional after exposure to defined X-ray radiation levels in accordance with ISO/IEC 10373-1.

X-Ray Stress Method

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016.

See ISO/IEC 10373-6:2016, 7.2.1.1;

Complete certification testing for ISO/IEC 14443 Type A contactless smart cards

Temperature cycling testing to evaluate product reliability under thermal stress