Additional VICC Test Methods

Evaluation of mechanical strength of ICC modules using the three-wheel mechanical stress method specified in ISO/IEC 10373-1.

The purpose of this test is to determine the effect of a specified mechanical abrasion to the passport data page of a document conforming to ICAO. The main purpose is to test the MRZ but the test may also be used for the VIZ of the passport as defined by ICAO Doc 9303, 7 th Edition, Part 3. In order to perform this test, the datapage shall be personalized.

Additional test methods to assess the mechanical strength of cards with ICM and contactless integrated circuit cards are described in Annex A . The tests allow the user to define the mechanical performance of cards. The ranking shall be done by the user.

See ISO/IEC 10373-7:2019, 9.2;

The purpose of this test is to provide a means to determine the bond strength between the card and ICM. ICM-to-card adhesion is a function of the card material, ICM, adhesive employed and the assembly process.

The area of the ICM shall be the full visible area of the ICM, not just the metallized area, nor just the adhesive area. The adhesive between the ICM and the card is a key factor of the ICC's durability and is designed to bond plastic and other materials (card and ICM substrate). Many variables ranging from physical properties of the related substrates, process parameters to end use environment can affect the adhesion. This test is a destructive test with concentrated pressure on the exposed reverse side of the ICM, opposite to the contacts. The test attempts to push the ICM out of the card. The force is applied directly to the centre of the reverse side of the ICM through an opening in the card. The opening in the card is created specifically for this test.

The purpose of this method is to establish that sufficient bond strength exists between the card and the ICM of an IC card with contacts. This test is destructive and tested cards are not suitable for further use. With certain ICC designs, this test can cause localized detachment of the adhesive near the connection points of the antenna. If the ICM remains firmly attached in all four corners, then this should not be seen as a failure. The visual check shall be done at bending stage.

Assessment of card surface adhesion and resistance to blocking after stacked exposure under elevated temperature and controlled humidity according to ISO/IEC 10373-1.

This test is derived from ISO 105-B02 and exposes the sample to illumination from an artificial light source that represents natural daylight in the visible and near UV (UV A) spectral region. The aim of this test is to assess the resistance of the MRP to fading. NOTE The blue wool reference numbers refer to those preferred in Europe (1-8) and not those preferred in the US (L2-L9). This method is difficult to apply to ordinary security printing backgrounds due to the fine structure of the linework.

Measurement of card deflection under defined static load to determine bending stiffness and residual deformation in accordance with ISO/IEC 10373-1.

This test simulates the stresses of sitting on an MRP. This method applies a force to the MRP and forces it to bend around a curved surface. The resulting stresses acting on the MRP are a combination of compression and bending stresses.

The purpose of this test is to measure the extent of warpage in the MRP. The amount of warping in the MRP is important to ensure contactless IC and MRZ readability. This method is similar to the datapage and cover warpage evaluation method but measures the amount of warpage with the MRP in the closed position.

Measurement of card thickness and width under controlled load and environmental conditions according to ISO/IEC 10373-1 to verify compliance with ISO/IEC 7810 physical characteristics.

Verification of card dimensional stability and flatness after environmental exposure cycles at specified temperature and humidity conditions as defined in ISO/IEC 10373-1.

Measurement of card flatness deviation (warpage) using a rigid reference plate and gauge in accordance with ISO/IEC 10373-1 to verify compliance with base standard dimensional requirements. The purpose of this test is to measure the degree of warpage of a card test sample.

This evaluation method determines the change in appearance of the sample following exposure to artificial daylight. This evaluation method relies on the sample being subjected to 8.14 .

Baseline conditioning stress method for passport book durability evaluation.

The neutral salt spray (NSS ) test is the test method in which a neutral 5 % sodium chloride solution is atomized under a controlled environment . The purpose of the NSS test is to accelerate corrosion processes in order to evaluate the performance and durability of materials and surface treatments within a relatively short period of time

The purpose of this method is to determine the adhesion of surface and near surface features to deeper layers.

The purpose of this test is to measure the extent of warpage in the MRP. The amount of warping in an MRP is important to ensure contactless IC and MRZ readability.

The purpose of this test is to determine the bending fatigue resistance of the booklet construction to fully reversed loading. This method differs from the back pocket stress method by avoiding directly applied pressure. This method accelerates fatigue due to imposed bending, especially in the area of the antenna and associated connections if present.

Evaluation of mechanical and functional durability of cards under cyclic bending around defined axes using calibrated jaw geometry as specified in ISO/IEC 10373-1.

Assessment of card mechanical and electrical robustness under cyclic torsional stress at defined rotation angles and frequency according to ISO/IEC 10373-1.

Verification of ICC resistance to electrostatic discharge events in accordance with ISO/IEC 10373-1 and referenced IEC ESD standards.

Assessment of proximity and vicinity integrated circuit cards under electrostatic field stress conditions as defined in ISO/IEC 10373-1.

Measurement of embossed character overall height and relief height using precision micrometer methods defined in ISO/IEC 10373-1.

IEC 60068-2-11 specifies a test method for assessing the corrosion resistance of electrotechnical products components, equipment and materials in a salt mist environment. Its objective is to verify that the comparative quality of a metallic material, with or without corrosion protection, is maintained when exposed to salt mist. This test method is useful for evaluating the quality and the uniformity of coatings applied to protect metals against corrosion. It is particularly useful for detecting discontinuities, such as pores and other defects, in certain metallic, organic, anodic oxide and conversion coatings.

IEC 60068-2-1 temperature tests at low temperatures, generally referred to as "cold tests", that are applicable to non-heat-dissipating and heat-dissipating specimens, to determine the ability of components, equipment, or other articles to be used, transported or stored at low temperature. This document is applicable to energized as well as non-energized specimens that normally achieve temperature stability during the test. The specimens can be subject to test in packed condition (to simulate transportation and storage) or in unpacked condition (to simulate use). This document does not specify tests to determine the impact of temperature changes on specimens.

Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) specifies a test procedure to determine the suitability of components, equipment, or other articles for use, transportation, and storage under conditions of high humidity combined with cyclic temperature changes and, in general, producing condensation on the surface of the specimen. This test method can also be used to validate the packaging of specimen for transportation and storage.

IEC 60068-2-38 specifies a composite test procedure, primarily intended for component type specimens, to determine, in an accelerated manner, the resistance of specimens to the deteriorative effects of high temperature/humidity and cold conditions. This test standard does not apply to specimens that are energized during the complete test. Specimens can be energized during the constant phases of the tests. Measurements on energized specimens are typically carried out during constant phases of the test unless specified otherwise.

IEC 60068-2-78 establishes a test method for determining the ability of components or equipment to withstand transportation, storage and use under conditions of high humidity. The object of this document is to investigate the effect of high humidity at constant temperature without condensation on a specimen over a specified period. It is applicable to small equipment or components as well as large equipment and can be applied to both heat-dissipating and non-heat-dissipating specimens.

IEC 60068‑2‑61 specifies a climatic sequence for environmental testing of products and components to evaluate their performance under defined combinations of climatic stresses. The purpose is to provide a standardized procedure for applying a sequence of climatic test conditions so that the effect of combined environmental influences on electrotechnical equipment can be assessed consistently and reproducibly.

This method evaluates the function of the PIC. The method determines that chip is still functioning and that it operates within normal and reasonable conditions. There is always a trade-off between the execution time of this method and the completeness of the test. If the MRP does not contain a chip, this evaluation method returns a pass result

See ISO/IEC 10373-7:2019, 8;

See ISO/IEC 10373-7:2019, 7.2;

Verification of dimensions and positional accuracy of ICC contacts using default ICC holder and reference axes in accordance with ISO/IEC 10373-1 and ISO/IEC 7816-2.

Assessment of mechanical robustness of ICC contact pads under defined mechanical loading conditions according to ISO/IEC 10373-1.

Measurement of electrical resistance of ICC contact pads using defined electrical conventions and apparatus in accordance with ISO/IEC 10373-1.

This test method may be used for in-process card fabrication evaluations or material selections, when the flexure characteristics of a card is desired to be tested and when a card type is suspected of being "brittle" or has experienced early field fractures. NOTE The flexure characteristic of a card is a function of fabrication process conditions, card materials, card thickness, presence or absence of embossed characters, or presence or absence of surface applied features.

This stress method applies a certain forced impact to the sample to simulate stamping of the document at a border control point.

See ISO/IEC 10373-7:2019, 8.3;

The test simulates mechanical abrasion of the card surface.

See ISO/IEC 10373-7:2019, 8.2.2;

Measurement of card opacity at near-IR and far-IR wavelengths using calibrated emitter-detector alignment to verify optical transmission limits defined in the base standard.

This stress method applies high or low temperature and humidity to the document for specified amounts of time. This stress simulates a document’s exposure to various climatic conditions. The purpose of the test is to demonstrate the resistance of MRP construction to such conditions in principle. The test refers to temperature stability defined in ICAO Doc 9303, 7 th Edition, Part 3.

Verification that the PCD correctly detects and resumes communication with a Type A PICC after having received a modulated field prior to ATQA reception in accordance with ISO/IEC TS 24192-2.

This test verifies that the PCD uses an AFI of 00h when polling for Type B PICCs as defined in ISO/IEC TS 24192-1:2020, 8.2 [Rdr4].

This test verifies the behaviour of the PCD when receiving modulated field before receiving ATQB as defined in ISO/IEC TS 24192-1:2020, 8.3 [Rdr6].

This test verifies that the PCD is immune to ElectroMagnetic Disturbance (EMD) signals generated by the PICC. The purpose of this test is to determine whether the PCD is insensitive to any load modulation amplitude below V E, PCD for all supported PICC to PCD bit rates.

This test verifies the ability of the PCD to recover correctly after exposure to ElectroMagnetic Disturbance events. The purpose of this test is to determine whether the PCD is disturbed by a test pattern sent t E, PCD before the PICC answer for all supported PICC to PCD bit rates.

Verification that the PCD correctly returns to ISO/IEC 14443-4 protocol operation when no suitable non-ISO/IEC 14443-4 application is found as required for PT interoperability.

This test verifies that the PCD complies with the requirements defined in the ISO/IEC 14443 series on reception of bits and values reserved for future use.

This test verifies that the PCD detects and selects a Type A Reference PICC entering the field and indicating no SFGT needed, in less than t detect , regardless of the moment when the Reference PICC is placed within range A or B of the contactless reader. t detect value is defined in ISO/IEC TS 24192-1:2020, 8.3 [Rdr5].

This test verifies that the PCD detects and selects a Type B Reference PICC entering the field and indicating no SFGT needed, in less than t detect , regardless of the moment when the Reference PICC is placed within range A or B of the contactless reader. t detect value is defined in ISO/IEC TS 24192-1:2020, 8.3 [Rdr5].

This test measures the field strength produced by a PCD in its operating volume. The maximum and minimum field strength values to be used with each Reference PICC are given in ISO/IEC 14443-2:2020, Table 1. NOTE 1 The test takes account of PICC loading of the PCD.

This test is used to verify that a PCD correctly detects the load modulation of a PICC which conforms to ISO/IEC 14443-2 for PICC to PCD bit rates of f c /128, f c /64, f c /32 and f c /16, if supported. In order to limit the testing time, only the highest PICC to PCD bit rate corresponding to every supported subcarrier f s shall be tested.

This test is used to verify that a PCD correctly detects the load modulation of a PICC which conforms to ISO/IEC 14443-2 for PICC to PCD bit rates of f c /8, f c /4 and f c /2, if supported.

This test is used to determine the index of modulation of the PCD field as well as the rise and fall times and the overshoot values as defined in ISO/IEC 14443-2 for all supported PCD to PICC bit rates.

This test measures the phase stability of the PCD RF carrier to ensure compliance with specified limits. The purpose of this test is to determine whether the PCD provides f c with a phase drift within the limit defined in ISO/IEC 14443-2.

This test determines that the PCD generates a field not higher than the average value specified in ISO/IEC 14443-1 for each PICC class.f

Additional PCD tests of ISO/IEC 14443-3 and ISO/IEC 14443-4 parameters shall be as defined in ISO/IEC 10373-6 Annex H The purpose of this test is to determine whether the PCD is disturbed by a test pattern sent t E, PCD before the PICC answer for all supported PICC to PCD bit rates.

This test verifies that the PICC complies with the requirements defined in the ISO/IEC 14443 series on reception of bits and values reserved for future use as defined in ISO/IEC TS 24192-1:2020, 9.2 [Obj1] .

This test measures the EMD level generated by the PICC and verifies compliance with the allowed limits. The purpose of this test is to determine that the PICC does not generate an electromagnetic disturbance amplitude V EMD higher than V E, PICC during t E, PICC as specified in ISO/IEC 14443-2 with the exceptions defined therein for all mandatory and supported optional PICC to PCD bit rates within the operating field range [ H min , H max ]. NOTE 1 The low EMD time t E, PICC is a function of FDT/TR0 as defined in ISO/IEC 14443-3:2018, 8.2. NOTE 2 The EMD limit V E, PICC is a function of the field strength.

Verification that the PICC remains operational and does not produce incorrect responses during controlled magnetic field ramp-up and ramp-down conditions as required for public transport interoperability.

This test verifies that the PICC complies with the requirements defined in the ISO/IEC 14443 series on reception of bits and values reserved for future use as defined in ISO/IEC TS 24192-1:2020, 9.2 [Obj1].

This test evaluates the maximum loading effect of the PICC on the PCD antenna current. The purpose of this test is to verify that the loading of the PICC conforms to ISO/IEC 14443-2.

This test verifies that the PICC operates as intended for all mandatory and supported optional PCD to PICC bit rates within the operating field range [ H min , H max ]

The purpose of this test is to verify the ability of the PICC to receive the PCD commands under the conditions as specified in ISO/IEC 14443-2 for all mandatory and supported optional PCD to PICC bit rates within the operating field range [ H min , H max ].

The test may be used to measure the resonance frequency of a PICC. When two or more PICCs are placed in the same PCD energizing field, the resonance frequency of each PICC decreases. Care should be taken in designing each PICC resonance frequency. The resonance frequency may depend on the field strength used during the measurement.

The purpose of this test is to check the behaviour of the PICC in relation to alternating magnetic field exposure at 13,56 MHz.

PICC tests of ISO/IEC 14443-3 and ISO/IEC 14443-4 parameters shall be as defined in Annex G and Annex L . Unless otherwise specified, the PICC-test-apparatus shall adapt its behaviour in reaction to any PICC response in the following cases: a) If the PICC sends one or several S(WTX) requests before the expected I-block, the PICC-test-apparatus shall adapt by sending necessary S(WTX) responses to continue the scenario as specified. b) If the PICC response is chained, the PICC-test-apparatus shall adapt by sending necessary R(ACK) to continue the scenario as specified. c) If the length of a frame sent by the PICC-test-apparatus exceeds FSC for Type A or maximum frame size for Type B, the PICC-test-apparatus shall adapt by chaining to continue the scenario as specified.

This test verifies that the PICC transmission characteristics meet the amplitude phase and timing requirements. The purpose of this test is to verify that the PICC transmission conforms with the PICC requirements specified in ISO/IEC 14443-2 for all mandatory and supported optional PICC to PCD bit rates within the operating field range [ H min , H max ].

The purpose of this test is to measure the peel strength between different layers used in passport constructions according to ISO/IEC 10373-1:2006, 5.3. If the sheet to be evaluated is composed of multiple layers, the peel strength evaluation should be conducted on all layers. A separate document should be used for each layer so that a consistent number of strips will be cut from the sheet.

Measurement of peel strength at the edge and centre of the card using a stabilised tensile test arrangement to evaluate layer adhesion performance according to ISO/IEC 10373-1.

Determination of interlayer bond strength of card materials using tensile peel testing at defined speed and geometry in accordance with ISO/IEC 10373-1.

The purpose of the test is to simulate writing over the PIC with a ball point pen simulating manual entries on visa pages. It is felt that depending on the construction of the passport, a pen might damage components of the passport (PIC, visa paper sheets). The page to be written on shall be one that is normally written on and shall provide maximum stress to the chip (if present). In the case where it is possible to write on pages on both sides of the chip sheet, separate MRPs should be evaluated. This method may not be suitable when devices like rivets are used, i.e. the pen may become damaged or stuck if features protrude from the page under test.

The intent of this method is to verify that the passport is (still) suitable for use as a travel document. To pass the evaluation method, the document shall be intact and shall still be machine readable. Some security features may be degraded or altered; however, the evaluation of these features may be subjective and specific to individual passports and are therefore outside the scope of this method. Extremes of temperature as well as the exposure to certain chemicals may affect various security features, especially inks. Changes in these features shall not be considered a failure unless they render the document unrecognisable as belonging to the bearer or could cause strong suspicion to the authorities of a counterfeit or forgery.

The purpose of this method is to evaluate the card’s resistance to the potentially damaging effects of plasticisers. Plasticisers can migrate into the card from adjacent materials and can change the card's physical properties.

The purpose of this test is to determine any adverse effects of a range of chemical contaminants on an MRP test sample. It is possible that the document may not be useable for travel after this test, but it is expected that the book shall be identifiable as belonging to the bearer. Certain security features incorporated into MRPs are designed to react to reagents in order to show that tampering has taken place. The action of these security features under the influence of the reagents shall not constitute a failure.

Evaluation of card performance and appearance after exposure to defined short-term and long-term chemical solutions including salt mist and artificial perspiration

Determination of card structural stability and deformation after exposure to elevated temperature conditions as specified in ISO/IEC 10373-1.

IEC 60749-13:2018 describes a salt atmosphere test that determines the resistance of semiconductor devices to corrosion. It is an accelerated test that simulates the effects of severe sea-coast atmosphere on all exposed surfaces. It is only applicable to those devices specified for a marine environment. The salt atmosphere test is considered destructive.

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

IEC 60749-6:2017 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43.

The purpose of the test is to assess the tearing resistance of the booklet pages and the sewing part during the usage of an MRP.

The purpose of the test is to determine the folding resistance of a sheet of an MRP at the spine.

See ISO/IEC 10373-7:2019, 5;

This stress method applies high or low temperature and humidity to the document for specified amounts of time. This stress simulates a document’s exposure to various storage conditions. The purpose of the test is to demonstrate the resistance of MRP construction to such conditions in principle. The test refers to temperature stability defined in ICAO Doc 9303, 7th Edition, Part 3.

The test simulates mechanical abrasion of the card surface.

Measurement of surface distortions; raised or depressed areas (excluding embossing) using profile measurement methods referenced by ISO/IEC 10373-1.

The purpose of the test is to saturate the card material at a fixed temperature with water and dry the material in the following step. This procedure first swells and in the second step shrinks the material which induces a significant higher stress compared to a standard RH test ( 5.7 ). The defined test parameters (50 °C / 95 % RH followed by 50 °C / 25 % RH) ensure card materials are saturated with water and dried afterwards.

The purpose of this test is to accelerate the aging process of the cards. The rate of humidity penetration increases with higher temperatures. The aging effect can then be evaluated with complementary tests, such as mechanical or thermo-mechanical tests. This method exposes the card to elevated temperature and humidity. It can be used in conjunction with other methods to evaluate the effect of aging on specified properties of the card.

This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The test methods, controls, and procedures described herein have been prepared to serve several purposes: a. To specify suitable conditions obtainable in the laboratory and at the device level which give test results equivalent to the actual service conditions existing in the field, and to obtain reproducibility of the results of tests. The tests described herein are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic or outer space location, since it is known that the only true test for operation in a specific application and location is an actual service test under the same conditions. b. To describe in one standard all of the test methods of a similar character which now appear in the various joint-services and NASA microelectronic device specifications, so that these methods may be kept uniform and thus result in conservation of equipment, manhours, and testing facilities. In achieving this objective, it is necessary to make each of the general tests adaptable to a broad range of devices. c. To provide for a level of uniformity of physical, electrical and environmental testing; manufacturing controls and workmanship; and materials to ensure consistent quality and reliability among all devices screened in accordance with this standard.

This stress method subjects the MRP to cycling between two temperature extremes. This stress simulates the thermal shock the MRP could experience due to thermal expansion and contraction of each MRP component. The test is conducted over a short period of time for each stress cycle.

The purpose of this test is to determine adverse mechanical or functional effects in the MRP arising from torsional fatigue. This method differs from the back pocket stress method by applying only torsional stresses to the MRP.

See ISO/IEC 10373-7:2019, 8.1.2;

Verification that the card remains testably functional after exposure to defined X-ray radiation levels in accordance with ISO/IEC 10373-1.

The purpose of this test is to determine any adverse effects to the MRP by x-rays levels that might be encountered during border control screening. The MRP shall comply with the requirement in ISO/ IEC 7810 when tested in accordance with ISO/IEC 10373-1. It is permissible to perform the test on chip level and use the test certificates supplied by the chip manufacturer.

See ISO/IEC 10373-6:2016, 6.2.2.

See ISO/IEC 10373-6:2016, 7.2.2.1. This test is optional.

See ISO/IEC 10373-6:2016, 7.2.5.1 amended by ISO/IEC 10373-6:2016/Amd.3:2018.

The purpose of this test is to check if the eMRTD operates its application within the operating field strength range defined in ISO/IEC 14443-2.

This test is a basic functionality check test. The purpose of this test is to check if the eMRTD’s mandatory LDS application data as specified in ICAO Doc 9303-10 can be retrieved from the eMRTD. It shall be verified that this information has not been altered by the destructive tests.

The purpose of this test is to check the electrical functionality of the eMRTD and may be used in addition to the process specified in ISO/IEC 10373-6:2016, G.5.1.1.

See ISO/IEC 10373-6:2016, 6.1.1.1

The purpose of this test is to check if the eMRTD reader generates a carrier frequency in the range defined in ISO/IEC 14443-2.

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016. See to ISO/IEC 10373-6:2016, 7.1.6.1. This test is optional.

See ISO/IEC 10373-6:2016, 7.1.7.1. This test is optional.

See ISO/IEC 10373-6:2016, 7.1.1.1

See ISO/IEC 10373-6:2016, 7.1.5.1

See ISO/IEC 10373-6:2016, 7.1.4.1.

See ISO/IEC 10373-6:2016, 7.2.1.1.

See ISO/IEC 10373-6:2016, 7.2.4.1 .

See ISO/IEC 18745-2; ISO/IEC 10373-6:2016. See ISO/IEC 10373-6:2016, 6.2.2 .

Perform the tests defined in ISO/IEC 10373-6:2016, Annex G and Annex L at room temperature and 1,5 A/m(rms) according to the information provided in Table 3 . The test command sequences to apply are defined in 5.5 . The appropriate block number in each test scenario needs to be respected. S(PARAMETERS) empty block information tag 'A0 00' CRC shall be used in scenarios G.66 to G.70. Tests ISO/IEC 10373-6:2016, G.3.2 polling and ISO/IEC 10373-6:2016, G.4.2 polling shall be executed with the minimum delay between each Type as defined in Doc 9303-10, B.2. NOTE The operating field condition chosen to perform these tests [1,5 A/m (rms)] represents the worst case.

See ISO/IEC 10373-6:2016, 7.2.1.1;

Overview This test method provides comprehensive certification testing for ISO/IEC 14443 Type A contactless smart cards according to international standards. What We Test Physical characteristics RF interface parameters Protocol compliance Operating distance

Overview Thermal cycling testing evaluates the reliability of electronic components under repeated temperature changes. Test Conditions Temperature range: -40°C to +85°C Cycle duration: Customizable Number of cycles: Up to 1000

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